Supersonic-Test-Rocket
chaxaf
Hardware for EPFL Rocket Team Hermes Supersonic Test Rocket
Components (10)
| Reference | Value | Description |
|---|---|---|
| IC1,IC2 | MAX31855KASA+ | MAX31855KASA+, 14 bit Temperature Sensor +/-2 C SPI 3 3.6 V 8-Pin SOIC |
| U1 | RSCDJNI060PASE3 | |
| C1,C4,C5 | 100nF | |
| C2 | 10uF | |
| C3,C6 | 10nF | |
| H1,H3 | MountingHole | |
| J1,J2 | terminal block | PCB terminal block, nominal current: 6 A, rated voltage (III/2): 160 V, nominal cross section: 0.5 mm?, Number of potentials: 2, Number of rows: 1, Number of positions per row: 2, product range: MPT 0,5, pitch: 2.54 mm, connection method: Screw connection with tension sleeve, mounting: Wave soldering, conductor/PCB connection direction: 0 ?, color: green, Pin layout: Linear pinning, Solder pin [P]: 3.5 mm, type of packaging: packed in cardboard |
| J3 | B2B-PH-K-S_LF__SN_ | |
| R1-R6 | 1kΩ | |
| R7,R8 | 10kOhm |