DualLaserPDHDriver
scular-HCC
Dual laster Pound-Dreaver-Hall driver setup. 1550 nm DFBs. Q=10^-5. Less than 20 GHz difference
Components (6)
| Reference | Value | Description |
|---|---|---|
| H1-H4 | M3 | M3 x 40mm standoff to CH_Card (3.2mm clearance). The standoffs set the 40mm board gap and carry the daughter-card + heat-spreader mass; the connector pins are signal only. |
| J1 | ESQ-107-12-G-D | Stacking socket to CH_Card J_BTF1 (TSW-107-21-G-D). Samtec ESQ-107-12-G-D: 11.05mm body, 2.29mm tail. 40mm board-to-board on M3 x 40mm standoffs -> 4.58mm insertion (spec 3.68-6.35mm). Pin N == DFB1550LP butterfly pin N. |
| JP1 | LD SHORT | Shorting shunt across the laser diode for ESD/transient protection during handling, storage and insertion. MUST BE REMOVED before the laser is driven - fitted, it shorts LD_A to LD_K. |
| JZ1 | Azimuth 5253-100-7S | ZIF socket, butterfly pins 1-7. Contact plane 7.62mm above this board face. VERIFY pin 1 is at the latch end against the physical socket - the Azimuth sheet marks LATCH END but does not number contacts. |
| JZ2 | Azimuth 5253-100-7R | ZIF socket, butterfly pins 14-8 (contact 1 = pin 14, at the same end of the package as pin 1). S-to-R separation must be set in LAYOUT from the measured lead-row spacing; datasheet gives 26.0mm overall lead span and a 12.7mm body. |
| LD1 | DFB1550LP | Held in JZ1/JZ2, not soldered. Ith 5.5mA, Iop max 100mA, Vf max 3.0V, TEC max 2.0A/4.0V, NTC 10k @25C, MPD 2.2uA/mW. |